Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828220 | Flip chip-in-leadframe package and process | Marcos Karnezos, Walter A. Bush, Jr. | 2004-12-07 |
| 6815252 | Method of forming flip chip interconnection structure | — | 2004-11-09 |
| 6780682 | Process for precise encapsulation of flip chip interconnects | — | 2004-08-24 |
| 6737295 | Chip scale package with flip chip interconnect | Nazir Ahmad, Andrea Chen, Kyung-Moon Kim, Young Do Kweon, Samuel Tam | 2004-05-18 |