YK

Young Do Kweon

CH Chippac: 1 patents #2 of 8Top 25%
📍 Suwon-si, CA: #22 of 47 inventorsTop 50%
Overall (2004): #82,504 of 270,089Top 35%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6737295 Chip scale package with flip chip interconnect Rajendra D. Pendse, Nazir Ahmad, Andrea Chen, Kyung-Moon Kim, Samuel Tam 2004-05-18