Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6737295 | Chip scale package with flip chip interconnect | Rajendra D. Pendse, Andrea Chen, Kyung-Moon Kim, Young Do Kweon, Samuel Tam | 2004-05-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6737295 | Chip scale package with flip chip interconnect | Rajendra D. Pendse, Andrea Chen, Kyung-Moon Kim, Young Do Kweon, Samuel Tam | 2004-05-18 |