MK

Marcos Karnezos

CH Chippac: 1 patents #2 of 8Top 25%
📍 Palo Alto, CA: #350 of 926 inventorsTop 40%
🗺 California: #8,555 of 28,370 inventorsTop 35%
Overall (2004): #162,595 of 270,089Top 65%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6828220 Flip chip-in-leadframe package and process Rajendra D. Pendse, Walter A. Bush, Jr. 2004-12-07