Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835598 | Stacked semiconductor module and method of manufacturing the same | Joong-Hyun Baek, Jin-Yang Lee, Tae-koo Lee | 2004-12-28 |
| 6781849 | Multi-chip package having improved heat spread characteristics and method for manufacturing the same | Joong-Hyun Baek, Tae-koo Lee, Min-ha Kim | 2004-08-24 |
| 6756668 | Semiconductor package having thermal interface material (TIM) | Joong-Hyun Baek, Ho-Jeong Moon, Dong-Kil Shin | 2004-06-29 |