Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6781849 | Multi-chip package having improved heat spread characteristics and method for manufacturing the same | Joong-Hyun Baek, Tae-koo Lee, Yun-Hyeok Im | 2004-08-24 |
MK
Min-ha Kim
Overall (2004): #153,395 of 270,089Top 60%
1
Patents 2004