Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835598 | Stacked semiconductor module and method of manufacturing the same | Joong-Hyun Baek, Jin-Yang Lee, Yun-Hyeok Im | 2004-12-28 |
| 6781849 | Multi-chip package having improved heat spread characteristics and method for manufacturing the same | Joong-Hyun Baek, Min-ha Kim, Yun-Hyeok Im | 2004-08-24 |