Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6756668 | Semiconductor package having thermal interface material (TIM) | Joong-Hyun Baek, Dong-Kil Shin, Yun-Hyeok Im | 2004-06-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6756668 | Semiconductor package having thermal interface material (TIM) | Joong-Hyun Baek, Dong-Kil Shin, Yun-Hyeok Im | 2004-06-29 |