Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821891 | Atomic layer deposition of copper using a reducing gas and non-fluorinated copper precursors | Ling Chen | 2004-11-23 |
| 6705246 | RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition | Sujit Sharan, Gurtej S. Sandhu, Paul Smith | 2004-03-16 |
| 6699530 | Method for constructing a film on a semiconductor wafer | Michal Danek, Marvin Liao, Eric A. Englhardt, Yeh-Jen Kao, Dale R. DuBois +1 more | 2004-03-02 |