Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6797642 | Method to improve barrier layer adhesion | Karen Chu, Anil Vijayendran | 2004-09-28 |
| 6764940 | Method for depositing a diffusion barrier for copper interconnect applications | Robert T. Rozbicki | 2004-07-20 |
| 6699530 | Method for constructing a film on a semiconductor wafer | Marvin Liao, Eric A. Englhardt, Mei Chang, Yeh-Jen Kao, Dale R. DuBois +1 more | 2004-03-02 |
| 6673716 | Control of the deposition temperature to reduce the via and contact resistance of Ti and TiN deposited using ionized PVD techniques | Gerard C. D'Couto, George Tkach, Michael Woitge | 2004-01-06 |