Issued Patents 2004
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833049 | Apparatus for controlling the temperature of a gas distribution plate in a process reactor | Kevin G. Donohoe | 2004-12-21 |
| 6828227 | Method for applying uniform pressurized film across wafer | Hugh E. Stroupe, Lynn J. Carroll | 2004-12-07 |
| 6827824 | Enhanced collimated deposition | Gurtej S. Sandhu | 2004-12-07 |
| 6812160 | Methods of forming materials between conductive electrical components, and insulating materials | Werner Juengling, Kirk D. Prall, Ravi Iyer, Gurtej S. Sandhu | 2004-11-02 |
| 6758735 | Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates | — | 2004-07-06 |
| 6746317 | Methods and apparatuses for making and using planarizing pads for mechanical and chemical mechanical planarization of microelectronic substrates | — | 2004-06-08 |
| 6743724 | Planarization process for semiconductor substrates | Trung T. Doan, Mark Durcan, Scott Meikle | 2004-06-01 |
| 6713312 | Field emission tips and methods for fabricating the same | Sanh D. Tang, Zhaohui Huang | 2004-03-30 |
| 6693034 | Deadhesion method and mechanism for wafer processing | Hugh E. Stroupe, Brian F. Gordon | 2004-02-17 |
| 6683003 | Global planarization method and apparatus | — | 2004-01-27 |
| 6674158 | Semiconductor die package having a UV cured polymeric die coating | — | 2004-01-06 |