Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815825 | Semiconductor devices having gradual slope contacts | — | 2004-11-09 |
| 6759324 | Method of forming a low resistance contact to underlying aluminum interconnect by depositing titanium in a via opening and reacting the titanium with the aluminum | Howard E. Rhodes | 2004-07-06 |
| 6740573 | Method for forming an integrated circuit interconnect using a dual poly process | Martin C. Roberts | 2004-05-25 |
| 6727150 | Methods of forming trench isolation within a semiconductor substrate including, Tshaped trench with spacers | — | 2004-04-27 |
| 6713312 | Field emission tips and methods for fabricating the same | Guy T. Blalock, Zhaohui Huang | 2004-03-30 |
| 6703709 | Structures formed using silicide cap as an etch stop in multilayer metal processes | — | 2004-03-09 |
| 6700205 | Semiconductor devices having contact plugs and local interconnects | Daniel M. Smith, Jason Taylor | 2004-03-02 |
| 6693025 | Local interconnect structures for integrated circuits and methods for making the same | Michael P. Violette | 2004-02-17 |