Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6794285 | Slurry for CMP, and method of manufacturing semiconductor device | Yukiteru Matsui, Gaku Minamihaba | 2004-09-21 |
| 6790769 | CMP slurry and method of manufacturing semiconductor device | Nobuyuki Kurashima, Gaku Minamihaba | 2004-09-14 |
| 6740590 | AQUEOUS DISPERSION, AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USED FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, AND METHOD FOR FORMATION OF EMBEDDED WRITING | Gaku Minamihaba, Yukiteru Matsui, Katsuya Okumura, Akira Iio, Masayuki Hattori | 2004-05-25 |
| 6726540 | Polishing cloth and method of manufacturing semiconductor device using the same | — | 2004-04-27 |
| 6723572 | Method for monitoring the shape of the processed surfaces of semiconductor devices and equipment for manufacturing the semiconductor devices | Katsuya Okumura | 2004-04-20 |
| 6722964 | Polishing apparatus and method | Norio Kimura, Mitsuhiko Shirakashi, Katsuya Okumura, You Ishii, Junji Kunisawa | 2004-04-20 |
| 6720250 | Method of manufacturing a semiconductor device using a slurry for chemical mechanical polishing of copper | Gaku Minamihaba | 2004-04-13 |