Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6794285 | Slurry for CMP, and method of manufacturing semiconductor device | Yukiteru Matsui, Hiroyuki Yano | 2004-09-21 |
| 6794286 | Process for fabricating a metal wiring and metal contact in a semicondutor device | Hisako Aoyama, Kyoichi Suguro, Hiromi Niiyama, Hitoshi Tamura, Hisataka Hayashi +2 more | 2004-09-21 |
| 6790769 | CMP slurry and method of manufacturing semiconductor device | Nobuyuki Kurashima, Hiroyuki Yano | 2004-09-14 |
| 6740590 | AQUEOUS DISPERSION, AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USED FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, AND METHOD FOR FORMATION OF EMBEDDED WRITING | Hiroyuki Yano, Yukiteru Matsui, Katsuya Okumura, Akira Iio, Masayuki Hattori | 2004-05-25 |
| 6720250 | Method of manufacturing a semiconductor device using a slurry for chemical mechanical polishing of copper | Hiroyuki Yano | 2004-04-13 |