Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6827635 | Method of planarizing substrates | Olaf Kuehn, Andreas Roemer, Alexander William Simpson | 2004-12-07 |
| 6821894 | CMP process | Stephan Wege | 2004-11-23 |
| 6787431 | Method and semiconductor wafer configuration for producing an alignment mark for semiconductor wafers | — | 2004-09-07 |
| 6695687 | Semiconductor substrate holder for chemical-mechanical polishing containing a movable plate | Mark Hollatz | 2004-02-24 |
| 6689691 | Method of simultaneously polishing a plurality of objects of a similar type, in particular silicon wafers, on a polishing installation | — | 2004-02-10 |