AS

Alexander William Simpson

Infineon Technologies Ag: 2 patents #200 of 1,096Top 20%
IBM: 1 patents #1,866 of 5,464Top 35%
📍 Hillsboro, OR: #34 of 206 inventorsTop 20%
🗺 Oregon: #370 of 2,300 inventorsTop 20%
Overall (2004): #73,637 of 270,089Top 30%
2
Patents 2004

Issued Patents 2004

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6827635 Method of planarizing substrates Peter Lahnor, Olaf Kuehn, Andreas Roemer 2004-12-07
6740539 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Daniel C. Edelstein, Gill Yong Lee +3 more 2004-05-25