Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6746897 | Fabrication process of semiconductor package and semiconductor package | Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara +2 more | 2004-06-08 |
| 6708398 | Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package | Yoshiaki Wakashima, Kazuhisa Suzuki, Takeshi Casey Funaki | 2004-03-23 |