Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6746897 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata +2 more | 2004-06-08 |
| 6713589 | Phenyl, naphthly or fluorene cyclopentyl epoxy resins | Haruaki Sue, Fumio Furusawa, Seiichi Akagi, Akihiro Kobayashi, Hideki Yokoyama | 2004-03-30 |