Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6746897 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara +2 more | 2004-06-08 |