Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6708398 | Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package | Yoshiaki Wakashima, Naoki Fukutomi, Takeshi Casey Funaki | 2004-03-23 |