Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6732911 | Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system | Hirohisa Matsuki, Hiroyuki Matsui, Eiji Yoshida, Takao Ohno, Koki Otake +3 more | 2004-05-11 |
| 6686285 | Semiconductor device manufacture method preventing dishing and erosion during chemical mechanical polishing | Toshiyuki Karasawa, Tsutomu Hosoda, Satoshi Otsuka | 2004-02-03 |