Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6806118 | Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure | Keishiro Okamoto, Yasuo Yamagishi | 2004-10-19 |
| 6773947 | Method of manufacturing semiconductor device including an opening formed by a laser | — | 2004-08-10 |
| 6732911 | Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system | Hirohisa Matsuki, Hiroyuki Matsui, Eiji Yoshida, Takao Ohno, Koki Otake +3 more | 2004-05-11 |