Issued Patents 2004
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6832049 | Optical Module | Yasuhide Kuroda, Masakazu Kishi, Yoshinori Nakane, Kenichiro Tsubone, Yuji Miyaki +2 more | 2004-12-14 |
| 6812540 | Semiconductor integrated circuit device | Norikatsu Takaura, Riichiro Takemura, Hideyuki Matsuoka, Shinichiro Kimura, Hisao Asakura +1 more | 2004-11-02 |
| 6809364 | Semiconductor integrated circuit device and a method of manufacture thereof | Hideyuki Matsuoka, Isamu Asano, Ryo Nagai, Tomonori Sekiguchi, Riichiro Takemura | 2004-10-26 |
| 6795216 | Print system and print method | Kouhei Ishikawa | 2004-09-21 |
| 6791137 | Semiconductor integrated circuit device and process for manufacturing the same | Kiyonori Oyu, Takafumi Tokunaga, Hiroyuki Enomoto, Toshihiro Sekiguchi | 2004-09-14 |
| 6785115 | Electrostatic chuck and substrate processing apparatus | Hideyoshi Tsuruta, Kiyoshi Nashimoto, Naoki Miyazaki | 2004-08-31 |
| 6770535 | Semiconductor integrated circuit device and process for manufacturing the same | Kiyonori Oyu, Shinichiro Kimura | 2004-08-03 |
| 6762508 | Semiconductor encapsulant resin having an additive with a gradient concentration | Shigeo Kiso, Ichiro Kataoka, Hidenori Shiotsuka, Hideaki Zenko | 2004-07-13 |
| 6756262 | Semiconductor integrated circuit device having spaced-apart electrodes and the method thereof | Yoshitaka Nakamura, Isamu Asano, Tsugio Takahashi, Yuzuru Ohji, Masayoshi Hirasawa +2 more | 2004-06-29 |
| 6734060 | Semiconductor integrated circuit device and process for manufacturing | Yoshitaka Nakamura, Isamu Asano, Keizou Kawakita | 2004-05-11 |
| 6693237 | Sealing composition for sealing solar cell, and solar cell module and building material-integral type solar cell module using said composition | Hideaki Zenko, Ichiro Kataoka, Hidenori Shiotsuka | 2004-02-17 |
| 6686619 | Dynamic random access memory with improved contact arrangements | Yoshitaka Nakamura, Hideo Aoki, Yoshikazu Ohira, Tadashi Umezawa, Keizou Kawakita +5 more | 2004-02-03 |