Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815762 | Semiconductor integrated circuit device and process for manufacturing the same including spacers on bit lines | Makoto Yoshida, Takahiro Kumauchi, Yoshitaka Tadaki, Kazuhiko Kajigaya, Isamu Asano | 2004-11-09 |
| 6812127 | Method of forming semiconductor device including silicon oxide with fluorine, embedded wiring layer, via holes, and wiring grooves | Takayuki Oshima, Hiroshi Miyazaki, Kazutoshi Ohmori | 2004-11-02 |
| 6774020 | Semiconductor device and method of manufacturing the same | Shinichi Fukada, Kazuo Nojiri, Takashi Yunogami, Shoji Hotta, Takayuki Oshima +1 more | 2004-08-10 |
| 6753219 | Method of manufacturing semiconductor integrated circuit devices having a memory device with a reduced bit line stray capacity and such semiconductor integrated circuit devices | Toshihiro Sekiguchi, Yoshitaka Tadaki, Keizo Kawakita, Toshikazu Kumai, Kazuhiko Saito +6 more | 2004-06-22 |
| 6742701 | Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus | Masahiko Furuno, Tsugunori Masuda, Kazuhide Doi | 2004-06-01 |
| 6686619 | Dynamic random access memory with improved contact arrangements | Yoshitaka Nakamura, Yoshikazu Ohira, Tadashi Umezawa, Satoru Yamada, Keizou Kawakita +5 more | 2004-02-03 |