Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6767827 | Method for forming dual inlaid structures for IC interconnections | Fei Wang, James Kai | 2004-07-27 |
| 6756300 | Method for forming dual damascene interconnect structure | Fei Wang, Jerry Cheng, Minh Quoc Tran, Lu You | 2004-06-29 |
| 6713382 | Vapor treatment for repairing damage of low-k dielectric | Suzette K. Pangrle, Ecran Adem, Calvin T. Gabriel | 2004-03-30 |
| 6699792 | Polymer spacers for creating small geometry space and method of manufacture thereof | Fei Wang, Lu You | 2004-03-02 |