Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790710 | Method of manufacturing an integrated circuit package | Neil McLellan, Chun Ho Fan, Tsang Cheung, Chow Keung, Sadak Thamby Labeeb | 2004-09-14 |
| 6734552 | Enhanced thermal dissipation integrated circuit package | Robert Sheppard, Tai Wai Pun, Hau Wan Ng, Chun Ho Fan, Neil Robert McLellen | 2004-05-11 |
| 6724071 | Molded plastic package with heat sink and enhanced electrical performance | — | 2004-04-20 |