Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818978 | Ball grid array package with shielding | — | 2004-11-16 |
| 6818472 | Ball grid array package | Joseph Martin, Ming Wang Sze, Tak Sang Yeung | 2004-11-16 |
| 6800948 | Ball grid array package | Joseph Martin, Ming Wang Sze, Tak Sang Yeung | 2004-10-05 |
| 6790710 | Method of manufacturing an integrated circuit package | Neil McLellan, Edward Combs, Tsang Cheung, Chow Keung, Sadak Thamby Labeeb | 2004-09-14 |
| 6781242 | Thin ball grid array package | Kwok Cheung Tsang, William Lap Keung Chow | 2004-08-24 |
| 6734044 | Multiple leadframe laminated IC package | Tsui Yee Lin, Kin Pui Kwan, Shui Ming Tse, Wing Him Lau, Shuk Man Wong | 2004-05-11 |
| 6734552 | Enhanced thermal dissipation integrated circuit package | Edward Combs, Robert Sheppard, Tai Wai Pun, Hau Wan Ng, Neil Robert McLellen | 2004-05-11 |