Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6734552 | Enhanced thermal dissipation integrated circuit package | Edward Combs, Robert Sheppard, Tai Wai Pun, Chun Ho Fan, Neil Robert McLellen | 2004-05-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6734552 | Enhanced thermal dissipation integrated circuit package | Edward Combs, Robert Sheppard, Tai Wai Pun, Chun Ho Fan, Neil Robert McLellen | 2004-05-11 |