Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821817 | Premolded cavity IC package | Labeeb Sadak Thamby, Hugo Chi Wai Wong, William Lap Keung Chow | 2004-11-23 |
| 6790710 | Method of manufacturing an integrated circuit package | Chun Ho Fan, Edward Combs, Tsang Cheung, Chow Keung, Sadak Thamby Labeeb | 2004-09-14 |
| 6737755 | Ball grid array package with improved thermal characteristics | Ming Wang Sze, Wing Keung Lam, Kin-wai Wong | 2004-05-18 |