Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649509 | Post passivation metal scheme for high-performance integrated circuit devices | Mou-Shiung Lin, Jin-Yuan Lee, Ching-Cheng Huang | 2003-11-18 |
| 6642136 | Method of making a low fabrication cost, high performance, high reliability chip scale package | Jin-Yuan Lee, Ching-Cheng Huang, Chuen-Jye Lin | 2003-11-04 |
| 6605528 | Post passivation metal scheme for high-performance integrated circuit devices | Mou-Shiung Lin, Jin-Yuan Lee, Ching-Cheng Huang | 2003-08-12 |