Issued Patents 2003
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6657310 | Top layers of metal for high performance IC's | — | 2003-12-02 |
| 6649509 | Post passivation metal scheme for high-performance integrated circuit devices | Ming-Ta Lei, Jin-Yuan Lee, Ching-Cheng Huang | 2003-11-18 |
| 6620728 | Top layers of metal for high performance IC's | — | 2003-09-16 |
| 6605528 | Post passivation metal scheme for high-performance integrated circuit devices | Ming-Ta Lei, Jin-Yuan Lee, Ching-Cheng Huang | 2003-08-12 |
| 6593649 | Methods of IC rerouting option for multiple package system applications | Tah-Kang Joseph Ting | 2003-07-15 |
| 6586266 | High performance sub-system design and assembly | — | 2003-07-01 |
| 6555398 | Software programmable multiple function integrated circuit module | — | 2003-04-29 |
| 6515369 | High performance system-on-chip using post passivation process | — | 2003-02-04 |