Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649509 | Post passivation metal scheme for high-performance integrated circuit devices | Mou-Shiung Lin, Ming-Ta Lei, Ching-Cheng Huang | 2003-11-18 |
| 6642136 | Method of making a low fabrication cost, high performance, high reliability chip scale package | Ming-Ta Lei, Ching-Cheng Huang, Chuen-Jye Lin | 2003-11-04 |
| 6635936 | SRAM layout for relaxing mechanical stress in shallow trench isolation technology | Shou-Gwo Wuu, Dun-Nian Yaung, Jeng-Han Lee | 2003-10-21 |
| 6613606 | Structure of high performance combo chip and processing method | — | 2003-09-02 |
| 6605528 | Post passivation metal scheme for high-performance integrated circuit devices | Mou-Shiung Lin, Ming-Ta Lei, Ching-Cheng Huang | 2003-08-12 |
| 6600186 | Process technology architecture of embedded DRAM | Mong-Song Liang | 2003-07-29 |
| 6522009 | Apparatus to electroless plate a metal layer while eliminating the photo electric effect | — | 2003-02-18 |