Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6642136 | Method of making a low fabrication cost, high performance, high reliability chip scale package | Jin-Yuan Lee, Ming-Ta Lei, Ching-Cheng Huang | 2003-11-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6642136 | Method of making a low fabrication cost, high performance, high reliability chip scale package | Jin-Yuan Lee, Ming-Ta Lei, Ching-Cheng Huang | 2003-11-04 |