HL

Hsien-Tsung Liu

TSMC: 1 patents #218 of 754Top 30%
📍 Keelung, TW: #11 of 36 inventorsTop 35%
Overall (2003): #208,724 of 273,478Top 80%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6583039 Method of forming a bump on a copper pad Yen-Ming Chen, Kuo-Wei Lin, Cheng-Yu Chu, Yang-Tung Fan, Fu-Jier Fan +2 more 2003-06-24