Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6607938 | Wafer level stack chip package and method for manufacturing same | Yong-Hwan Kwon, Dong-Hyeon Jang, Min Kyo Cho, Gu-Sung Kim | 2003-08-19 |
| 6586275 | Wafer level package and method for manufacturing the same | Gu-Sung Kim, Dong-Hyeon Jang, Min Young Son | 2003-07-01 |
| 6555921 | Semiconductor package | Yong-Hwan Kwon, Nam-Seog Kim, Dong-Hyeon Jang | 2003-04-29 |
| 6518675 | Wafer level package and method for manufacturing the same | Gu-Sung Kim, Dong-Hyeon Jang, Min Young Son | 2003-02-11 |