Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6607938 | Wafer level stack chip package and method for manufacturing same | Yong-Hwan Kwon, Sa-Yoon Kang, Dong-Hyeon Jang, Min Kyo Cho | 2003-08-19 |
| 6586275 | Wafer level package and method for manufacturing the same | Dong-Hyeon Jang, Min Young Son, Sa-Yoon Kang | 2003-07-01 |
| 6518675 | Wafer level package and method for manufacturing the same | Dong-Hyeon Jang, Min Young Son, Sa-Yoon Kang | 2003-02-11 |