Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6608377 | Wafer level package including ground metal layer | Tae-Sub Chang, Dong-Ho Lee | 2003-08-19 |
| 6586275 | Wafer level package and method for manufacturing the same | Gu-Sung Kim, Dong-Hyeon Jang, Sa-Yoon Kang | 2003-07-01 |
| 6518675 | Wafer level package and method for manufacturing the same | Gu-Sung Kim, Dong-Hyeon Jang, Sa-Yoon Kang | 2003-02-11 |