Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6607938 | Wafer level stack chip package and method for manufacturing same | Yong-Hwan Kwon, Sa-Yoon Kang, Dong-Hyeon Jang, Gu-Sung Kim | 2003-08-19 |
MC
Min Kyo Cho
Overall (2003): #158,673 of 273,478Top 60%
1
Patents 2003