Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6614659 | De-mountable, solderless in-line lead module package with interface | Haim Feigenbaum, Blake F. Woith, Terry Wang | 2003-09-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6614659 | De-mountable, solderless in-line lead module package with interface | Haim Feigenbaum, Blake F. Woith, Terry Wang | 2003-09-02 |