Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6614659 | De-mountable, solderless in-line lead module package with interface | Blake F. Woith, John Steven Szalay, Terry Wang | 2003-09-02 |
| 6547944 | Commercial plating of nanolaminates | Chris M. Schreiber, Mordechay Schlesinger, Robert Martinez, William R. Crumly | 2003-04-15 |