Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6614659 | De-mountable, solderless in-line lead module package with interface | Haim Feigenbaum, Blake F. Woith, John Steven Szalay | 2003-09-02 |
| 6595785 | Bump contact force concentration system and method | Eric Dean Jensen, Christopher Schreiber, Scott P. Cohen, Robert E. Daugherty, Blake F. Woith | 2003-07-22 |
| 6567267 | Apparatus capable of air-filtering and heat-dissipating and adapted for use in a computer | — | 2003-05-20 |