Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6614659 | De-mountable, solderless in-line lead module package with interface | Haim Feigenbaum, John Steven Szalay, Terry Wang | 2003-09-02 |
| 6595785 | Bump contact force concentration system and method | Eric Dean Jensen, Christopher Schreiber, Terry Wang, Scott P. Cohen, Robert E. Daugherty | 2003-07-22 |
| 6533588 | Connector assembly for flexible circuits | Leslie Ann Hardie | 2003-03-18 |