Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660406 | Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit | Takashi Kataoka, Naotomi Takahashi | 2003-12-09 |
| 6652993 | Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer | Takashi Syoujiguchi | 2003-11-25 |
| 6548153 | Composite material used in making printed wiring boards | Takashi Kataoka, Yutaka Hirasawa, Kenichiro Iwakiri, Tsutomu Higuchi | 2003-04-15 |
| 6541126 | Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil | Junshi Yoshioka, Akiko Sugimoto, Sakiko Taenaka, Makoto Dobashi, Tsutomu Higuchi +1 more | 2003-04-01 |