Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6652725 | Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus | Kazuko Taniguchi, Hisao Sakai, Yasuji Hara | 2003-11-25 |
| 6649274 | Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil | Sakiko Taenaka, Akiko Sugimoto, Naotomi Takahashi | 2003-11-18 |
| 6610418 | Electolytic copper foil with carrier foil and method for manufacturing the same | Junshi Yoshioka, Akiko Sugimoto, Ken Iwakiri, Yutaka Hirasawa | 2003-08-26 |
| 6544664 | Copper foil for printed wiring board | Naotomi Takahashi, Yoichi Babasaki, Tsutomu Higuchi, Osamu Nakano, Hiroshi Watanabe +1 more | 2003-04-08 |
| 6541126 | Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil | Junshi Yoshioka, Akiko Sugimoto, Sakiko Taenaka, Tsutomu Higuchi, Takuya Yamamoto +1 more | 2003-04-01 |