Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660406 | Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit | Takuya Yamamoto, Takashi Kataoka | 2003-12-09 |
| 6649274 | Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil | Sakiko Taenaka, Makoto Dobashi, Akiko Sugimoto | 2003-11-18 |
| 6616827 | Filtration method of copper electrolyte | Kazuyoshi Nabekura, Yutaka Hirasawa | 2003-09-09 |
| 6605369 | Surface-treated copper foil and method for producing the same | Yutaka Hirasawa | 2003-08-12 |
| 6585877 | Method of producing a surface-treated copper foil | Masakazu Mitsuhashi, Takashi Kataoka | 2003-07-01 |
| 6579437 | Method of producing a surface-treated copper foil | Masakazu Mitsuhashi, Takashi Kataoka | 2003-06-17 |
| 6544664 | Copper foil for printed wiring board | Yoichi Babasaki, Tsutomu Higuchi, Osamu Nakano, Hiroshi Watanabe, Masaru Takahashi +1 more | 2003-04-08 |
| 6533915 | Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil | Masakazu Mitsuhashi, Takashi Kataoka | 2003-03-18 |
| 6531045 | Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil | Masakazu Mitsuhashi, Takashi Kataoka | 2003-03-11 |