Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660406 | Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit | Takuya Yamamoto, Naotomi Takahashi | 2003-12-09 |
| 6585877 | Method of producing a surface-treated copper foil | Masakazu Mitsuhashi, Naotomi Takahashi | 2003-07-01 |
| 6579437 | Method of producing a surface-treated copper foil | Masakazu Mitsuhashi, Naotomi Takahashi | 2003-06-17 |
| 6548153 | Composite material used in making printed wiring boards | Yutaka Hirasawa, Takuya Yamamoto, Kenichiro Iwakiri, Tsutomu Higuchi | 2003-04-15 |
| 6544663 | Electrodeposited copper foil | Osamu Nakano, Sakiko Taenaka, Naohito Uchida, Noriko Hanzawa | 2003-04-08 |
| 6533915 | Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil | Masakazu Mitsuhashi, Naotomi Takahashi | 2003-03-18 |
| 6531045 | Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil | Masakazu Mitsuhashi, Naotomi Takahashi | 2003-03-11 |