Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6610362 | Method of forming a carbon doped oxide layer on a substrate | — | 2003-08-26 |
| 6593650 | Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials | Ebrahim Andideh, Lawrence Wong | 2003-07-15 |
| 6586276 | Method for fabricating a microelectronic device using wafer-level adhesion layer deposition | Hajime Sakamoto, Dongdong Wang | 2003-07-01 |
| 6555906 | Microelectronic package having a bumpless laminated interconnection layer | Paul H. Wermer | 2003-04-29 |
| 6518171 | Dual damascene process using a low k interlayer for forming vias and trenches | — | 2003-02-11 |