Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6605551 | Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance | Brian Kaiser | 2003-08-12 |
| 6555906 | Microelectronic package having a bumpless laminated interconnection layer | Steven Towle | 2003-04-29 |