Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656822 | Method for reduced capacitance interconnect system using gaseous implants into the ILD | Brian S. Doyle, Brian Roberds, Sandy Lee | 2003-12-02 |
| 6586822 | Integrated core microelectronic package | Jian Li, Qing Ma, Maria V. Henao, Xiao-Chun Mu | 2003-07-01 |
| 6586836 | Process for forming microelectronic packages and intermediate structures formed therewith | Qing Ma, Xiao-Chun Mu, Steve Towle | 2003-07-01 |