Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6624457 | Stepped structure for a multi-rank, stacked polymer memory device and method of making same | Jian Li | 2003-09-23 |
| 6600364 | Active interposer technology for high performance CMOS packaging application | Chunlin Liang | 2003-07-29 |
| 6586822 | Integrated core microelectronic package | Quat Vu, Jian Li, Qing Ma, Maria V. Henao | 2003-07-01 |
| 6586836 | Process for forming microelectronic packages and intermediate structures formed therewith | Qing Ma, Quat Vu, Steve Towle | 2003-07-01 |
| 6524887 | Embedded recess in polymer memory package and method of making same | Jian Li | 2003-02-25 |